HPE P48817-B21 – CPU Heat Sink Kit

In stock

Key Features

Passive CPU cooling heat sink kit
Designed for DL380 / DL560 Gen11
High thermal conductivity design
Works with chassis airflow system

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HPE P48817-B21 – CPU Heat Sink Kit

Overview

HPE P48817-B21 is an enterprise CPU heat sink kit designed for HPE ProLiant DL380 and DL560 Gen11 rack servers. It is used to dissipate heat generated by high-performance server processors during continuous workloads. The heat sink is a passive thermal component that transfers heat from the CPU into the chassis airflow system, where server fans remove it from the system. It is essential for maintaining stable processor temperatures and ensuring reliable server operation under heavy compute loads.
It is deployed in enterprise data center environments where servers run 24×7 under workloads such as virtualization, cloud infrastructure, database processing, and enterprise applications. The heat sink works as part of the server’s overall thermal design and ensures efficient heat transfer from the processor to the cooling system. It does not operate independently and depends on system airflow for proper cooling.

Typical Deployment Scenarios

Enterprise virtualization servers
Cloud infrastructure systems
Database processing servers
High-density rack environments
Mission-critical data center workloads

Specifications

Specification Value
Brand HPE
Part Number P48817-B21
Product Type CPU Heat Sink Kit
Cooling Type Passive heatsink
Function Processor heat dissipation
Compatibility HPE ProLiant DL380 Gen11 / DL560 Gen11
Installation CPU socket mounted assembly
Material Type High thermal conductivity metal
Usage Enterprise server cooling
Environment Data center
System Dependency Works with chassis airflow fans
Operation Continuous 24×7 duty cycle
Thermal Role CPU thermal management component

Compatibility / Ecosystem

HPE P48817-B21 integrates into HPE ProLiant DL380 and DL560 Gen11 server platforms as part of the CPU thermal subsystem. It works in combination with chassis fans and system airflow design to maintain safe operating temperatures for processors. The heat sink ensures efficient heat transfer from the CPU to the airflow system, supporting stable performance under sustained workloads. It is widely used in enterprise environments where reliability, uptime, and thermal stability are critical.

Additional information

Weight 2.85 kg
Dimensions 60.0 × 33.4 × 19.1 cm
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