HPE 875070-001 – CPU Heat Sink Kit

HPE 875070-001 CPU Heat Sink Kit

Overview

HPE 875070-001 is an enterprise CPU heat sink kit used in HPE ProLiant rack server platforms. It is designed to dissipate heat generated by server processors during continuous high-load operations. The heat sink is a passive thermal component that transfers heat from the CPU into the chassis airflow system, where server fans remove it from the enclosure. It plays a critical role in maintaining stable processor temperatures and preventing thermal throttling in enterprise workloads.
It is deployed in data center environments where servers operate 24×7 under virtualization, cloud infrastructure, database processing, and application hosting workloads. The heat sink is part of the server’s thermal design and works in combination with chassis airflow to ensure reliable CPU performance under sustained load conditions. It does not function independently and depends on active cooling from system fans.

Typical Deployment Scenarios

Enterprise virtualization servers
Cloud infrastructure environments
Database processing systems
High-density rack server deployments
Mission-critical data center workloads

Specifications

Compatibility / Ecosystem

HPE 875070-001 integrates into supported HPE ProLiant rack server platforms as part of the CPU thermal subsystem. It works in coordination with chassis fans and airflow design to maintain safe operating temperatures for processors. The heat sink ensures efficient heat transfer from the CPU to the cooling system, enabling stable performance under heavy workloads. It is widely used in enterprise environments where system reliability and thermal stability are critical.