HPE P53227-001 – Server Chassis Fan Module
Key Features
Hot-plug active airflow fan module
Supports DL380 Gen11 rack servers
Firmware-controlled thermal management
Tool-less replacement fan design
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HPE P53227-001 Server Chassis Fan Module
Overview
HPE P53227-001 is a hot-plug chassis fan module designed for HPE ProLiant DL380 Gen11 rack servers. It provides active airflow inside the server chassis to maintain stable operating temperatures for processors, memory modules, storage controllers, and PCIe devices during sustained enterprise workloads. The fan module operates as part of the server’s thermal management architecture and dynamically adjusts airflow through firmware and sensor-based speed control.
The module is used in enterprise data centers running virtualization, cloud infrastructure, database workloads, and business-critical applications. It supports balanced airflow distribution across the chassis to reduce thermal hotspots and maintain system stability in dense rack deployments. The hot-plug design also allows fan replacement without shutting down the server, supporting high-availability environments.
Typical Deployment Scenarios
Enterprise virtualization servers
Cloud infrastructure deployments
Database and application systems
High-density 2U rack environments
Mission-critical data center workloads
Specifications
| Specification | Value |
|---|---|
| Brand | HPE |
| Part Number | P53227-001 |
| Product Type | Server Chassis Fan Module |
| Compatibility | HPE ProLiant DL380 Gen11 |
| Server Form Factor | 2U rack server |
| Cooling Type | Active airflow cooling |
| Installation Type | Hot-plug |
| Fan Control | Firmware and sensor managed |
| Redundancy Support | N+1 fan redundancy |
| Airflow Direction | Front-to-back cooling |
| Usage Environment | Enterprise data center |
| Operational Role | Internal chassis airflow management |
| Duty Cycle | Continuous 24×7 operation |
| Serviceability | Tool-less replacement |
Compatibility / Ecosystem
HPE P53227-001 integrates into HPE ProLiant DL380 Gen11 thermal management architecture and works with system sensors, firmware controls, and chassis airflow design to maintain proper internal cooling. The module supports redundant cooling configurations and is optimized for enterprise workloads operating continuously in rack-mounted data center environments. It is commonly deployed in systems requiring stable thermal performance and high uptime.
Additional information
| Weight | 0.051 kg |
|---|---|
| Dimensions | 75.31 × 43.46 × 4.29 cm |







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